11/27/2024, 11:43 AM UTC
安世斯包装可靠性问题导致成本增加Ansys Package Reliability Issues Cost Money
<p>➀ 在产品初期开发阶段，封装可靠性分析常常被忽视；</p><p>➁ 产品定型阶段发现的封装可靠性问题成本高昂；</p><p>➂ 2.5D和3D封装的快速采用由于新材料和扩展的热环境加剧了这些问题；</p><p>➃ 低K介电材料由于刚度更高和热应力，更容易发生灾难性开裂；</p><p>➄ 焊接疲劳是影响封装与PCB之间焊接连接的另一个可靠性问题；</p><p>➅ ANSYS Multiphysics可用于对材料堆叠进行彻底的热机械模拟，以减轻这些问题。</p><p>➀ Package reliability analysis is often overlooked during initial product development;</p><p>➁ Package reliability issues uncovered during product qualification cost significantly;</p><p>➂ The rapid adoption of 2.5D and 3D packaging exacerbates these issues due to new materials and extended thermal environments;</p><p>➃ Low-K dielectric materials are more prone to catastrophic cracking due to higher modulus of rigidity and thermal stress;</p><p>➄ Solder fatigue is another reliability issue affecting solder joint connections between package and PCB;</p><p>➅ ANSYS Multiphysics can be used for thorough thermal-mechanical simulation of material stackup to mitigate these issues.</p>
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