<p>➀ Package reliability analysis is often overlooked during initial product development;</p><p>➁ Package reliability issues uncovered during product qualification cost significantly;</p><p>➂ The rapid adoption of 2.5D and 3D packaging exacerbates these issues due to new materials and extended thermal environments;</p><p>➃ Low-K dielectric materials are more prone to catastrophic cracking due to higher modulus of rigidity and thermal stress;</p><p>➄ Solder fatigue is another reliability issue affecting solder joint connections between package and PCB;</p><p>➅ ANSYS Multiphysics can be used for thorough thermal-mechanical simulation of material stackup to mitigate these issues.</p>