10/27/2024, 11:48 AM UTC
Meta Minipack3 在 OCP 峰会 2024 展示Meta Minipack3 at OCP Summit 2024
➀ Meta的Minipack3,Meta的关键交换机,在OCP峰会2024上展出。它配备了64个OSFP端口,并使用800G光学设备。这款交换机由Broadcom设计并由Celestica制 造,目标噪音水平为78dba。它可以提供多达128个400GbE端口,并在2100W以下运行,展示了共封装光学解决方案的效率。 ➁ Meta的Minipack系列一直是最受欢迎的联网基础设施选择之一,这款新版本提供了显著的进步。 ➂ 400GbE的趋势日益明显,Meta在部署此类高速交换机以用于AI集群和快速远程存储方面处于领先地位。➀ Meta Minipack3, a key switch from Meta, was showcased at the OCP Summit 2024. It features 64 OSFP ports and uses 800G optics. The switch is designed by Broadcom and manufactured by Celestica, with a target noise level of 78dba. It can provide up to 128-ports of 400GbE and operates at under 2100W, showcasing the efficiency of co-packaged optics solutions. ➁ Meta's Minipack line has been a popular choice for networking infrastructure, with this new version offering significant advancements. ➂ The trend towards 400GbE is evident, with Meta leading the way in deploying such high-speed switches for AI clusters and fast remote storage.
---
本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。