➀ The new Google Cloud TPU v6e Trillium was showcased at SC24 without its heatsinks, highlighting Google's custom AI accelerator with improved performance, interconnect, and memory. ➁ The v6e chip offers double the HBM memory from 16GB to 32GB, doubling the bandwidth, and improves INT8 and bfloat16 performance by around 4.6-4.7x compared to the v5e version. ➂ The new generation quadruples the interconnect bandwidth from two 100Gbps links to four 200Gbps links, and the inter-chip interconnect bandwidth more than doubles.