11/30/2024, 11:02 AM UTC
SC24展会上的谷歌云TPU v6e Trillium亮相Google Cloud TPU v6e Trillium Shown at SC24
➀ 在SC24展会上，谷歌云TPU v6e Trillium未安装散热器展出，展示了谷歌定制的AI加速器在性能、互连和内存方面的改进。➁ v6e芯片将HBM内 存从16GB增加到32GB，带宽翻倍，与v5e版本相比，INT8和bfloat16性能提高了约4.6-4.7倍。➂ 新一代将互连带宽从两个100Gbps链路增加到四个200Gbps链路，芯片间互连带宽也增加了不止一倍。➀ The new Google Cloud TPU v6e Trillium was showcased at SC24 without its heatsinks, highlighting Google's custom AI accelerator with improved performance, interconnect, and memory. ➁ The v6e chip offers double the HBM memory from 16GB to 32GB, doubling the bandwidth, and improves INT8 and bfloat16 performance by around 4.6-4.7x compared to the v5e version. ➂ The new generation quadruples the interconnect bandwidth from two 100Gbps links to four 200Gbps links, and the inter-chip interconnect bandwidth more than doubles.
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