11/06/2024, 08:10 AM UTC
ECOC2024：硅光外腔光源方案ECOC2024: Silicon Photonics External Cavity Laser Solutions
<p>➀ 硅光异质集成：OpenLight Photonics在Tower Semiconductor平台上展示其基于硅光异质集成的可调谐激光器和DFB激光器。异质IIIV在硅上已经开始商用。</p><p>➁ 硅光倒装键合集成：采用成熟的倒装键合工艺实现窄线宽外腔可调谐激光器，其键合精度达到700nm@3σ，达到量产水平。</p><p>➂ 硅光端对端混合集成：端对端耦合采用SSC，制作超低kappa光栅性能外腔，具有快速频率扫描特性，对传感应用很重要。</p><p>➀ Silicon photonics heterogeneous integration: OpenLight Photonics demonstrates its tunable and DFB lasers based on silicon photonics heterogeneous integration on the Tower Semiconductor platform. Heterogeneous IIIV on silicon has started commercial use.</p><p>➁ Silicon photonics flip-chip bonding integration: Narrow linewidth external cavity tunable lasers are achieved using mature flip-chip bonding technology, with a key bonding precision of 700nm@3σ, reaching mass production level.</p><p>➂ Silicon photonics end-to-end hybrid integration: End-to-end coupling uses SSC to make ultra-low kappa grating performance external cavity. It has fast frequency sweep characteristics using LNOI, and is important for sensing applications.</p>
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