03/04/2025, 11:39 PM UTC
Marvell发布2nm芯片，剑指英伟达Marvell Unveils 2nm Chip, Targeting NVIDIA
➀ Marvell展示了其用于下一代AI和云基础设施的首款2nm硅片IP；
➁ 该硅片采用台积电的2nm工艺生产，是Marvell平台的一部分，用于开发定制XPU、交换机和其他技术，以提升云服务提供商的全球运营性能、效率和经济潜力；
➂ Marvell的平台战略以开发全面的半导体IP产品组合为中心，包括SerDes、芯片到芯片互连、先进的封装技术、定制高带宽存储器(HBM)计算架构等；
➃ Marvell还推出了3D同步双向I/O，运行速度高达6.4 Gbits/秒，用于连接芯片内部的垂直堆叠芯片；
➄ 公司预计到2028年，定制硅片将占据加速计算市场的约25%；
➅ Marvell的2nm平台针对台积电的2nm工艺技术，包括开发云优化加速器、以太网交换机和数字信号处理器所必需的技术；
➆ Marvell的定制HBM计算架构允许XPU实现更高的计算和内存密度；
➇ 新架构通过序列化和加速AI计算加速器硅片与HBM基片之间的I/O接口来增强XPU性能；
➈ Marvell的定制AI加速器架构将XPU计算硅片、HBM和其他芯片与Marvell 3D SiPho引擎整合在同一基板上；
➉ Marvell一直是改变互连技术的先驱，致力于提高加速基础设施的性能、可扩展性和经济性。
➀ Marvell showcased its first 2nm silicon wafer IP designed for next-generation AI and cloud infrastructure;
➁ The wafer, produced using TSMC's 2nm process, is part of Marvell's platform for developing custom XPU, switches, and other technologies to enhance cloud service providers' global operations;
➂ Marvell's platform strategy focuses on developing a comprehensive semiconductor IP product portfolio, including SerDes, chip-to-chip interconnects, advanced packaging technologies, and custom high-bandwidth memory (HBM) computing architectures;
➃ Marvell also introduced 3D synchronous bidirectional I/O with speeds up to 6.4 Gbits/second for connecting vertically stacked chips within a single die;
➄ The company expects custom silicon to account for about 25% of the accelerated computing market by 2028;
➅ Marvell's 2nm platform is tailored for TSMC's 2nm process technology and includes technologies for developing cloud-optimized accelerators, Ethernet switches, and digital signal processors;
➆ Marvell's custom HBM computing architecture allows XPU to achieve higher computing and memory density;
➇ The new architecture enhances XPU performance by serializing and accelerating the I/O interface between the AI computing accelerator silicon wafer and the HBM wafer;
➈ Marvell's custom AI accelerator architecture integrates XPU computing silicon wafers, HBM, and other chips with Marvell's 3D SiPho engine on the same substrate;
➉ Marvell has been a pioneer in changing interconnect technology, focusing on improving the performance, scalability, and cost-effectiveness of accelerated infrastructure.
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