03/20/2025, 10:41 AM UTC
国内10家SiC企业联手，聚焦8吋、晶圆制造Domestic SiC Companies Collaborate, Focusing on 8-Inch Wafer Manufacturing
➀ 多家SiC企业，包括扬杰科技、重投天科、拓普电子和中恒微等，正在合作推进碳化硅产品的研发与生产。
➁ 中恒微半导体与芯合半导体签署战略合作协议，聚焦SiC晶圆制造和模块封装，旨在实现“SiC晶圆设计-制造-模块封装”全链条技术闭环。
➂ 重投天科、鹏进高科和尚阳通科技共同推进基于8英寸外延片的功率器件工艺开发。
➃ 扬杰科技与普兴电子、瀚天天成签约，打造高效SiC供应链。
➄ 拓普电子与普州产银成立合资公司，专注于超高压碳化硅大功率芯片项目。
➀ Multiple SiC companies, including Yangjie Technology, Chongqing Tianke, Tuopu Electronics, and Zhonghengwei, are collaborating to advance the research and production of SiC products.
➁ Zhonghengwei Semiconductor has signed a strategic cooperation agreement with Xinhua Semiconductor to focus on SiC wafer manufacturing and module packaging, aiming to achieve a full-chain technical closed loop.
➂ Chongqing Tianke, Pengjin High-tech, and Shangyangtong Technology are working together to develop power device processes based on 8-inch epitax wafers.
➃ Yangjie Technology has signed strategic cooperation意向s with Puxing Electronics and Hantiancheng to create an efficient SiC supply chain.
➄ Tuopu Electronics and Pu Zhou City Industrial Bank have established a joint venture to focus on ultra-high-voltage SiC power chip projects.
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