06/17/2025, 12:40 PM UTC
Cadence联合三星Foundry加速AI数据中心、汽车及互联领域SoC、3D-IC与Chiplet设计Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
➀ Cadence与三星Foundry深化合作，签署多年IP协议开发面向SF4X、SF5A和SF2P工艺的内存/接口IP；
➁ 采用AI驱动设计工具优化3D-IC与Chiplet系统的性能、功耗和面积；
➂ 聚焦AI数据中心、汽车电子和互联解决方案等新一代应用领域。
➀ Cadence expands collaboration with Samsung Foundry, signing multi-year IP agreement to develop memory/interface IP for SF4X, SF5A and SF2P nodes;
➁ Utilizes AI-driven design tools to optimize performance, power and area for complex 3D-IC and chiplet systems;
➂ Targets next-gen applications in AI data centers, automotive electronics and connectivity solutions.
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