➀ A 1978 article by Mike Evans of National Semiconductor highlighted the critical role of efficient memory usage in microprocessor systems and the lack of universal controllers for MADRAMs (Multiplexed Address DRAMs) in multi-chip configurations;

➁ MADRAMs, like the MM5290, utilized separate row/column strobes for page-mode operation but required specialized controllers that limited timing and power-saving optimizations;

➂ The article proposed a general-purpose MADRAM controller to bridge 8/16-bit microprocessors with various memory setups, focusing on address multiplexing and selective RAS activation for enhanced efficiency.

➀ ASA Motion Link simplifies automotive cabling design for camera and sensor integration;

➁ Provides high-speed communication capabilities to support advanced automotive systems;

➂ Enhives connectivity efficiency in next-generation vehicle architectures

➀ Embedd.it launched a cross-vendor graphical MCU configurator at Microelectronics UK, leveraging AI to unify data from 1,400+ MCU families (e.g., Renesas, STMicroelectronics) for embedded software development;

➁ The tool simplifies pin assignment, device tree generation, and driver automation, reducing design time and enabling hardware migration across vendors to strengthen supply chain resilience;

➂ Available as a Visual Studio Code extension and web app, it will soon support bare-metal configuration outputs.

➀ EU member states push for quadrupling semiconductor investment to address lagging global production targets;

➀ Europe's 2022 Chips Act aimed for 20% global market share by 2030 but may only reach 11.7%;

➂ Dutch-led coalition proposes streamlined approvals, enhanced funding access, and dedicated budgets to boost EU chip sovereignty.

➀ Physicists demonstrated a quantum computer with over 3,000 qubits operating stably for two hours without data loss, leveraging exponential computational potential of qubits;

➁ The breakthrough used optical lattice conveyor belts and neutral atoms, enabling continuous atom reloading (300,000/sec) to maintain qubit stability;

➂ The system achieved over 50 million atomic cycles with new error-correction techniques, advancing scalable quantum processors for practical applications.

➀ Microchip Technology introduces the MCP9604, a four-channel thermocouple conditioning IC that integrates converters, amplifiers, and compensation sensors to achieve ±1.5°C accuracy in industrial temperature monitoring.

➁ The chip simplifies system design by replacing 15+ external components and uses advanced NIST temperature equations to enhance measurement precision, supporting eight thermocouple types including K-type with a range of -200°C to +1372°C.

➂ Designed for applications like medical devices and HVAC systems, it features an I2C interface for seamless digital integration and reduces calibration costs in production environments.

➀ Pasquale Pistorio rose through the ranks at Motorola for 17 years, becoming its first non-American VP and a key figure in global semiconductor marketing;

➁ He transformed the near-bankrupt SGS-Ates (later ST Microelectronics) into the world's third-largest chipmaker by merging with Thomson Semiconducteurs, achieving profitability and zero debt by 1994;

➂ Known for blending American managerial rigor with human-centric values, he championed R&D, corporate social responsibility, and closing the global technology gap, earning knighthoods from Italy and France.

➀ The US-China semiconductor competition has reportedly led to the resurgence of Alibaba founder Jack Ma, as Chinese authorities showcased Alibaba's in-house AI chip as a domestic alternative to NVIDIA's H20 GPU during Premier Li Qiang's visit to a Qinghai data center;

➁ The Chinese government urged domestic customers to prioritize local chips over NVIDIA's H20, citing security concerns, which halted H20 production;

➂ Jack Ma re-emerged publicly after five years of low visibility following the halted Ant Financial IPO, with his viral bar meeting and the slogan 'Make Alibaba Great Again' signaling his renewed influence.

➀ Space Forge partners with United Semiconductors to develop semiconductor materials produced in space for quantum computing, power electronics, and sensors;

➁ Collaboration combines Space Forge's microgravity platform and United Semiconductors' III-V crystal growth expertise to onshore resilient supply chains;

➂ Aims to commercialize space-based semiconductor manufacturing and advance sustainable low-Earth orbit economies.

➀ Imec and Diraq demonstrated silicon quantum dot qubits with error rates below the threshold for quantum error correction, achieving over 99% fidelity in one- and two-qubit gate operations;

➁ The qubits were fabricated using imec's industrial 300mm spin qubit platform and isotopically enriched silicon, ensuring low electrical/magnetic noise and high reproducibility;

➂ This collaboration validates a scalable, cost-effective semiconductor industry approach to mass-producing millions of qubits, a critical milestone for practical quantum computing.

➀ The UK faces strong local opposition to datacentre construction due to water supply concerns, but national policies mandate their approval even in green belts;

➁ Ed proposes adopting water-free liquid-cooling technology to the Secretary of State, allowing environmentally sustainable datacentre development;

➂ By positioning himself as a technical advisor for datacentre approvals, Ed gains significant political influence and access to lucrative government contracts.

➀ The UK government announced a £10m investment with Innovate UK to support early-stage semiconductor innovation in areas like chip design and advanced packaging;

➁ A £19m Semiconductor Hub will enhance industry-academia collaboration, leveraging regional strengths such as South Wales' compound semiconductor cluster and photon/electronics hubs;

➂ Additional initiatives include £5m for chip design enablement, £40m over five years for semiconductor education, and regional investments in power electronics and photonics.

➀ Vishay's SL2220007 NTC thermistor received UL certification, verifying compliance with global safety standards;

➁ The component offers 7A steady-state current, 125J energy handling, and 265VRMS voltage capability for high-demand power designs;

➂ It is optimized for industrial applications including UPS systems, motor controls, and power supplies with minimized inrush current effects.

➀ Hahn-Schickard's FeMEA project received €1.95 million funding from Germany's BMFTR to develop CMOS-based microelectrode arrays using ferroelectric materials for improved bioelectronic interfaces;

➁ The innovation enhances stimulation efficiency and long-term stability while minimizing harmful electrochemical currents, addressing key challenges in bioelectronics;

➂ The technology, protected by patents, targets biomedical applications and aims for industrial transfer, supported by a newly established research group led by Dr. Becker.

➀ Hahn-Schickard's FeMEA project develops ferroelectic microelectrode arrays using CMOS chips with ferroelectric materials, aiming to enhance bioelectronic interfaces;

➁ The project received €1.95 million over five years from the German Federal Ministry and addresses challenges in stimulation efficiency and long-term stability for biomedical applications;

➂ Achievements include a patented CMOS-based prototype with over 5,000 electrodes per mm², enabling precise cell stimulation and recording while suppressing harmful electrochemical effects.

➀ Renesas announced the RA8T2 MCU series for high-end motor control, featuring a 1 GHz Arm Cortex-M85 processor and optional Cortex-M33, enabling real-time control and AI-driven maintenance prediction in industrial and robotic systems;

➁ The MCUs integrate advanced peripherals like Gigabit Ethernet, EtherCAT, and high-speed MRAM, along with DSP/ML acceleration via Helium technology to enhance precision and reduce downtime;

➂ Key technical highlights include support for multi-phase PWM timers, simultaneous three-phase current sampling, and safety features like rapid PWM shutdown for overcurrent protection.

➀ The UK government announced a £10 million semiconductor innovation funding program, claiming it will drive technological advancements across industries;

➁ The budget is widely criticized as inadequate, with TSMC's equivalent capital expenditure for just three hours dwarfing the entire UK initiative;

➂ Industry experts and commentators ridicule the initiative's disconnect from reality, highlighting bureaucratic inefficiencies and lack of strategic alignment with semiconductor sector needs.

➀ The automotive semiconductor market is projected to grow from $68 billion in 2024 to $132 billion by 2030 (10% CAGR), five times faster than the auto market's 2% growth rate;

➁ Infineon, NXP, and ST lead the market, while Chinese firms, backed by national policies, advance in ADAS and power SiC. OEMs like Tesla, BYD, and Nio are vertically integrating, disrupting traditional supply chains;

➂ TSMC and Samsung control sub-16nm node production, with capacity fully booked through 2027. Challenges include geopolitical risks, AI compute demands, and centralized vehicle architecture shifts.

➀ Intel's stock value stagnated over 25 years, with $10,000 invested in 2000 now equivalent to $18,651 after inflation;

➁ Intel spent $133.86 billion on stock buybacks from 2000-2021, raising questions about prioritizing financial maneuvering over process technology R&D;

➂ Former CEO Paul Otellini’s 2008 dismissal of Arm’s potential in smartphones highlights strategic missteps and managerial hubris.

➀ A research team at Kiel University discovered a groundbreaking phenomenon in graphene, where precise laser pulses control electron movement within femtoseconds, enabling ultra-fast spatial switching;

➁ Simulations revealed that homogeneous graphene clusters allow electron localization at specific edges, driven by topological states and electronic structure, ensuring stability even under disturbances;

➂ This innovation could accelerate electronic devices to the petahertz range (10,000x faster than current GHz technology), though challenges remain in integrating these processes into real circuits for applications like AI chips and high-performance computing.