➀ The VTT Technical Research Centre of Finland has been awarded €29 million for chip packaging development under the EU APECS pilot line project.

➁ VTT will focus on radio frequency technologies for 6G networks and the development of optical microsystems and chip packaging methods.

➂ VTT is involved in FAMES and NanoIC pilot line projects and will operate in Kvanttinova, a microelectronics and quantum technology RDI Hub.

➀ Alchip预计2024年营收将超过10亿美元，实现重大里程碑；

➁ 公司专注于先进技术，包括2nm测试车间的发布和3DIC设计流程的准备工作；

➂ Alchip通过灵活且强大的3DIC设计流程应对先进封装的挑战，优化功率传输、互连和热特性。

➀ The GeForce RTX 5060's launch has been pushed back to April 2025 due to 'chip supply constraints';

➁ The delay affects the RTX 5070, RTX 5080, and RTX 5090, with limited supply expected leading to instant sellouts;

➂ The AI boom is increasing semiconductor demand, impacting the availability of the new GeForce RTX 50 Series.

➀ The semiconductor industry is facing a paradigm shift due to the slowing down of traditional scaling.

➁ Chiplet-based architectures offer advantages such as modularity, customization, and improved yield.

➂ Innovations in packaging technology and pre-designed frameworks are streamlining chiplet design.

➀ OpenAI, the creator of ChatGPT, is about to finalize its first in-house AI chip design;

➁ The company plans to send the chips to TSMC for fabrication with an aim for mass production in 2026;

➂ This move is a significant step towards reducing reliance on NVIDIA.

➀ Anduril Industries, led by Palmer Luckey, is set to take over the US Army's Integrated Visual Augmentation System (IVAS) program, pending Department of Defense approval.

➁ The program includes advanced headgear with AR capabilities, and Anduril will manage production and development with Microsoft Azure as the preferred cloud provider.

➂ Palmer Luckey, the founder of Oculus VR and Anduril Industries, sees this as a deeply personal achievement, emphasizing the potential of the technology to save lives.

Hanwha Precision Machinery is on the verge of officially securing orders from SK Hynix for thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM). Sources indicate that the equipment manufacturer is in the final stages of verification with the chip-maker.

➀ NVIDIA CEO Jensen Huang introduced new tools at CES 2025 aimed at democratizing AI access for everyone, not just researchers or large enterprises.

➁ These tools include Project DIGITS, NEMO, and Blackwell GPUs, which are designed to be portable, scalable, and easy to use, reducing the barriers to AI adoption.

➂ The introduction of these tools aims to simplify workflows, lower the barrier to entry, and empower individuals and small teams with AI capabilities.

➀ proteanTecs提供先进的电子设备，具备自监控功能，以优化性能、降低功耗并防止故障；

➁ proteanTecs的AVS Pro™解决方案为客户实现了显著的节能效果，最高可达14%；

➂ proteanTecs通过生产测试和深度数据可见性解决方案，帮助公司优化芯片性能并缩短上市时间。

➀ The Fraunhofer Society's Saxony microelectronics institutes are expanding their technological capabilities in the field of chiplet innovation and significantly contributing to the APECS Pilot Line under the European Chips Act. Saxony is investing 38 million euros in support.

➁ The total funding amounts to 730 million euros, provided by Chips Joint Undertaking, the Federal Ministry of Education and Research (BMBF), and other national funding. APECS is coordinated by the Fraunhofer Society and implemented by the Research Factory Microelectronics Germany (FMD).

➂ The APECS Pilot Line is a key component of the EU Chips Act to promote chiplet innovations and increase research and manufacturing capacities for semiconductors in Europe.

➀ NVIDIA's stock price dropped 17% after Chinese startup DeepSeek launched its R1 model.

➁ The R1 model, developed in just two months and costing $6 million, rivals OpenAI's ChatGPT.

➂ NVIDIA responded to the development, emphasizing the importance of Test Time Scaling and the need for NVIDIA GPUs.

➀ The adoption of multi-die solutions in HPC chip designs is driven by advancements in interconnect technology, thermal management, and power delivery.

➁ Multi-die architectures offer higher performance, design flexibility, and cost efficiency compared to traditional monolithic designs.

➂ The current market demand for scalable, energy-efficient computing, especially in AI and HPC applications, positions multi-die solutions as a crucial component for future semiconductor developments.

➀ The semiconductor industry is expected to see significant expansion in 2025 with plans to start construction on 18 new fabrication plants (fabs).

➁ According to SEMI's World Fab Forecast, the industry is projected to grow to $697 billion in 2025, marking an 11.2% increase from 2024.

➂ Some of these fabs are scheduled for production in 2026 or later.

➀ PseudolithicIC, a startup focused on RF chipsets, has secured a $6 million seed funding round led by investors such as Entrada Ventures, Foothill Ventures, and Uncork Capital.

➁ The company's products integrate compound semiconductor chiplets into silicon wafers, aiming to revolutionize the technical performance and economic aspects of the RF and millimeter-wave communication industry.

➂ PseudolithicIC's proprietary technology combines high-performance compound semiconductor chiplets with low-cost 300mm silicon wafers, offering enhanced performance, power efficiency, and scalability for RF applications.

➀ High-speed digital designers face challenges in achieving GHz frequencies and multi-level signaling.

➁ Crosstalk analysis tools like Keysight's Crosstalk Analyzer can save time and cost by automating complex simulations.

➂ Power integrity analysis is crucial for managing power delivery networks in high-power applications like AI chips.

➀ Leading Chinese semiconductor equipment makers reported significant revenue growth in 2024.

➁ AMEC, ACM, and Naura saw increases in sales and profitability despite increased R&D spending.

➂ The growth is attributed to the increasing demand for chipmaking tools and the construction of new fabs in China.

➀ Silicon Creations achieved significant milestones in 2024, including shipping over ten million wafers and reaching 1000 production licenses for its Fractional SoC PLL IP.

➁ The company specializes in mixed-signal IP solutions focusing on clocking and high-speed data interfaces, working with various foundries and advanced process nodes.

➂ In 2025, Silicon Creations anticipates growth in AI accelerator chips, crypto mining, and automotive sectors, driven by customer tapeouts in advanced nodes and early interest in sub-2nm nodes.

➀ Okins Electronics announced on Wednesday that it will supply Samsung with over 400,000 units of semiconductor test sockets, valued at 6.65 billion won (approximately 11.7% of the company's revenue in 2023).

➁ A spokesperson for Okins Electronics stated that the majority of these sockets will be used for Samsung's production processes.

➂ This contract highlights the strong partnership between Okins Electronics and Samsung in the semiconductor industry.

➀ Performance validation in SoC designs is distinct from architectural exploration, focusing on evaluating actual performance to meet specifications.

➁ Hardware-Assisted Verification (HAV) platforms play a crucial role in performance validation by enabling real-world traffic testing and firmware performance tuning.

➂ Part 2 of 2 explores the performance validation process across hardware blocks and firmware in SoC designs, emphasizing the critical role of HAV platforms.

➀ Hua Hong Semiconductor, China's second-largest chip foundry, has appointed Bai Peng as its president to focus on advanced logic chip production.

➁ Bai Peng, with over three decades of experience at Intel, will help Hua Hong shift towards more advanced semiconductor production technologies.

➂ Hua Hong is expanding its production capabilities to include 40nm and above, aiming to become a key player in both legacy and advanced chip markets.