08/09/2024, 01:57 PM UTC
业界最薄DRAM封装助力设备端AIIndustry’s Thinnest DRAM Packages For On-Device AI
➀ 三星已开始大规模生产12纳米级LPDDR5X DRAM封装，这些封装更薄，热阻更好，适用于移动、游戏和AI设备。➁ 这些新型DRAM封装旨在提高空间效率和热管理，对设备端AI应用至关重要。➂ 三星还在开发更薄的24GB和32GB模块，以满足未来对紧凑型和高性能内存解决方案的需求。➀ Samsung has initiated mass production of 12-nanometer-class LPDDR5X DRAM packages, which are thinner and offer better heat resistance, suitable for mobile, gaming, and AI devices. ➁ These new DRAM packages are designed to enhance space efficiency and thermal management, crucial for on-device AI applications. ➂ Samsung is also developing even thinner 24GB and 32GB modules to meet future demands for compact and high-performance memory solutions.
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