06/03/2025, 04:49 AM UTC
台积电新A16技术将超越英特尔，计划2026年采用ASML High-NA EUV设备TBT For A Bond Market 'Crack'
1、台积电宣布2026年量产A16芯片技术，宣称性能将超越英特尔14A制程；2、与ASML合作引入尖端High-NA EUV光刻机，提升晶体管密度与能效；3、聚焦人工智能芯片性能突破，巩固全球晶圆代工市场领导地位。1. TSMC announces A16 chip manufacturing technology, set for 2026 production, claiming superiority over Intel's 14A process; 2. Collaboration with ASML to integrate cutting-edge High-NA EUV lithography machines for enhanced transistor density and efficiency; 3. Focus on advancing AI chip performance and maintaining competitive edge in the global foundry market.---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
