06/09/2025, 05:27 AM UTC
台积电A16芯片制造技术将采用ASML新一代High-NA EUV设备：报道IPO: Upgrading To Buy As The IPO Window Cracks Open
1、台积电计划于2027年前在其A16芯片制造技术中采用ASML新一代High-NA EUV光刻机；2、A16技术旨在提升晶体管密度和性能，与英特尔14A制程竞争；3、采用High-NA EUV表明台积电致力于保持先进半导体制造领先地位，尽管面临成本与良率等挑战。1. TSMC plans to adopt ASML's next-generation High-NA EUV machines for its A16 chip-making technology by 2027; 2. The A16 technology aims to improve transistor density and performance, competing with Intel's 14A node; 3. High-NA EUV adoption highlights TSMC's focus on maintaining leadership in advanced semiconductor manufacturing despite challenges like cost and yield.---
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