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06/01/2025, 04:19 AM UTC

台积电A16新技术将于2026年实现背面供电芯片制造，超越英特尔Grupo Aeroportuario del Pacifico: Successfully Navigating Some Choppy Airspace

1. 台积电宣布2026年量产采用背面供电技术的A16 1.6纳米制程；2. 背面供电轨设计提升芯片性能与能效，优于英特尔14A工艺；3. 台积电在先进半导体制造领域巩固领导地位，行业竞争加剧。

1. TSMC announces its A16 1.6nm chip manufacturing technology with backside power delivery, set for production in 2026; 2. The backside power rail design improves chip performance and energy efficiency, outperforming Intel's 14A process; 3. TSMC reinforces its leadership in advanced semiconductor manufacturing amid intensifying industry competition.

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