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blocksandfiles

07/18/2024, 11:50 AM UTC

Neo开发用于AI的计算3D内存，绕过HBMNeo develops computational 3D memory for AI that sidesteps HBM

1、Neo Semiconductor开发了带有神经电路的3D DRAM，通过避免从HBM到GPU的数据传输来加速AI处理；2、3D X-AI 300层，128 Gbit DRAM芯片每芯片提供10 TBps的AI处理能力，最高可扩展至120 TBps；3、Neo声称3D X-AI芯片通过模拟人工神经网络，非常适合加速下一代AI芯片和应用。

1. Neo Semiconductor has developed 3D DRAM with neuron circuitry to accelerate AI processing by avoiding data transfers from HBM to GPUs; 2. The 3D X-AI 300-layer, 128 Gbit DRAM chip offers 10 TBps of AI processing per die and can scale up to 120 TBps; 3. Neo claims the 3D X-AI chip is ideal for accelerating next-generation AI chips and applications by simulating artificial neural networks.

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