04/21/2025, 06:02 AM UTC
无铅焊膏用于先进组装Lead-Free Solder Paste For Advanced Assembly
➀ SHENMAO America, Inc. 推出了PF606-P无铅焊膏，专为先进的“反向混合”组装工艺设计，该工艺提高了前沿电子产品的可靠性和制造良率。
➁ “反向混合”工艺结合了SAC焊膏与带有低温焊料（LTS）球的BGA组件，形成均匀的SAC-LTS焊点，提升了热循环和跌落测试性能。
➂ 此方法具有出色的印刷性、焊接性和最小化空洞的优势，适用于下一代先进封装如CPU等，同时保持标准SAC回流条件并简化集成过程。
➀ SHENMAO America, Inc. introduces PF606-P lead-free solder paste for the advanced 'Reverse Hybrid' assembly process, which enhances product reliability and increases manufacturing yields for cutting-edge electronics.
➁ The 'Reverse Hybrid' process combines SAC solder paste with BGA components featuring low-temperature solder (LTS) balls, resulting in a homogeneous SAC-LTS solder joint that improves thermal cycling and drop test performance.
➂ This method offers superior printability, solderability, and minimal voiding, making it ideal for next-generation advanced packages like CPUs, while maintaining standard SAC reflow conditions and simplifying integration.
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