06/25/2025, 10:32 AM UTC
弗劳恩霍夫IZM-ASSID成立15周年：德累斯顿分部引领未来微电子技术15 Years of Fraunhofer IZM-ASSID: The Future of Microelectronics Shaped by Fraunhofer IZM’s Dresden Site
➀ 弗劳恩霍夫IZM-ASSID成立15周年，成为3D系统集成与晶圆级封装领域的全球创新引擎，主导了硅通孔（TSV）和多层重分布层等关键技术研发；
➁ CEASAX（先进CMOS及异构集成中心）和APECS（欧盟芯片法案试点项目）两大旗舰项目聚焦300mm微电子全产业链与chiplet技术，强化欧洲在半导体封装和边缘AI领域的竞争力；
➂ 与格芯、英飞凌、西门子等企业的深度合作，以及与德累斯顿理工的产学研联动，巩固了其作为欧洲高技术创新枢纽的地位。
➀ Fraunhofer IZM-ASSID celebrated 15 years as a pioneer in 3D system integration and wafer-level packaging, driving innovations like TSV processing and chiplet architectures;
➁ Flagship projects CEASAX (300mm microelectronics R&D) and APECS (EU Chips Act pilot line) strengthen Europe's competitiveness in semiconductor advanced packaging and edge AI;
➂ Strategic collaborations with GlobalFoundries, Infineon, Siemens, and academia solidify its role in global high-tech ecosystems and technological resilience.
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