05/30/2025, 05:25 PM UTC
台积电公布突破性封装技术以满足激增的AI芯片需求Trump And Bessent Do A 180-Degree Turn And That Is A Very Bullish Factor For The Stock Market
1. 台积电推出SoIC和CoWoS先进封装技术，提升芯片性能和集成度；2. 新工艺旨在满足英伟达、AMD等企业对AI芯片的爆发性需求；3. 通过优化封装环节缓解供应链压力，巩固其在半导体领域的竞争优势。1. TSMC introduces new SoIC and CoWoS packaging technologies to enhance chip performance and integration; 2. The innovation addresses booming AI chip demand from companies like NVIDIA and AMD; 3. Advanced packaging helps mitigate supply chain bottlenecks and strengthens TSMC's competitive edge in the semiconductor industry.---
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