10/18/2024, 05:31 PM UTC
Microchip的RTG4 FPGAs采用无铅翻转芯片凸块达到最高太空认证Microchip’s RTG4 FPGAs With Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
➀ Microchip的RTG4 FPGAs采用无铅翻转芯片凸块，达到最高太空认证；➁ 该认证得到国防物流局（DLA）认可，为太空组件的最高认证级别；➂ RTG4 FPGAs专为太空应用中的高密度和性能设计，提供低功耗和抗配置故障的特性。➀ Microchip's RTG4 FPGAs achieve the highest space qualification with lead-free flip-chip bumps; ➁ The qualification is recognized by the Defense Logistics Agency (DLA) as the highest level for space components; ➂ The RTG4 FPGAs are designed for high density and performance in space applications, offering low power consumption and immunity to configuration upsets.
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