05/25/2025, 04:33 AM UTC
台积电、ASML和英特尔在挑战中推进High-NA EUV技术ServiceNow: The Price Of Mission-Critical Products
1、台积电、ASML和英特尔正合作推进High-NA EUV光刻技术，尽管面临高昂成本和技术挑战；2、High-NA EUV对制造更小晶体管的新一代芯片至关重要，将推动AI和高性能计算发展；3、挑战包括成本控制、良率提升和基础设施升级，但成功将巩固其在半导体创新领域的领导地位。1. TSMC, ASML, and Intel are collaborating to advance High-NA EUV lithography technology despite high costs and technical hurdles; 2. High-NA EUV is critical for producing next-gen chips with smaller transistors, enabling advancements in AI and high-performance computing; 3. Challenges include managing costs, improving yield rates, and upgrading infrastructure, but success could solidify leadership in semiconductor innovation.---
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