07/30/2024, 01:15 PM UTC
先进封装市场以11%的复合年增长率增长至2029年的695亿美元Advanced Packaging market growing at 11% CAGR 23-29 to $69.5bn
1、先进封装市场预计将以11%的复合年增长率增长，到2029年达到695亿美元。2、市场主要参与者包括日月光、安靠、台积电、英特尔和中芯国际。3、政府投资和战略合作伙伴关系正在推动先进封装供应链的转型。1. The advanced packaging market is projected to grow at a CAGR of 11% to reach $69.5 billion by 2029. 2. Key players in the market include ASE, Amkor, TSMC, Intel, and JCET. 3. Government investments and strategic partnerships are driving the transformation of the AP supply chain.
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