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electronicsforu

11/08/2024, 02:57 PM UTC

晶圆技术下的AI半导体性能AI Semiconductor Performance With Wafer Technology

➀ 开发了使用PECVD的4英寸异质结构制造技术，以提升AI半导体性能；➁ 该技术采用如TMDc等下一代材料，以实现低功耗、高性能半导体；➂ PECVD技术允许生产4英寸晶圆，支持更大、可重复的晶圆，适用于AI半导体应用。➀ A new 4-inch heterostructure fabrication technology using PECVD is developed to enhance AI semiconductor performance; ➁ The technology incorporates next-generation materials like TMDc for low-power, high-performance semiconductors; ➂ The PECVD technique allows for 4-inch wafer production, supporting larger, reproducible wafers for AI semiconductor applications.

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