Samsung Developing Custom HBM4 Solutions for Meta and Microsoft
11/15/2024, 04:10 AM UTC
三星为Meta和微软开发定制HBM4解决方案，以对抗台积电和SK海力士Samsung working on 'custom HBM4' solutions for Meta and Microsoft, to fight TSMC and SK hynix
➀ 三星正在为Meta和微软开发定制化的HBM4内存解决方案；➁ 预计到2025年底开始量产；➂ 新的HBM4内存将提供2TB/s的带宽和高达48GB的容量。➀ Samsung is developing customized HBM4 memory solutions for Meta and Microsoft; ➁ Mass production is expected by the end of 2025; ➂ The new HBM4 memory will offer 2TB/sec bandwidth and up to 48GB capacities.Samsung is reportedly in the early stages of developing HBM4 memory solutions, with a focus on custom solutions for tech giants Meta and Microsoft.
These custom solutions are expected to be tailored for Meta's AI chips, Maia 100, and Meta Artemis, as well as Microsoft's own AI chips. Samsung's expertise in memory and computational chip design positions it as a strong partner for these companies.
With the aim of reducing chip purchases and saving costs, these tech giants are designing and using their own AI accelerator chips, while still sourcing AI chips from companies like NVIDIA and AMD.
Samsung plans to begin mass production of HBM4 immediately after development completion, which is anticipated to be by the end of 2025. The new HBM4 memory is set to offer a significant increase in bandwidth and capacity compared to its predecessor, HBM3E.
The HBM4 memory is expected to have a memory bandwidth of 2TB/sec, a 66% increase over HBM3E, and a capacity of up to 48GB, a 33% increase. This new technology is set to debut with NVIDIA's next-gen Rubin R100 AI GPU.
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