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seekingalpha

06/19/2025, 03:00 PM UTC

台积电A16新技术将利用ASML高数值孔径EUV设备挑战英特尔14A工艺What I Wish I Knew Before Buying BDCs, REITs, And MLPs

1、台积电A16芯片制造技术计划通过ASML的高数值孔径EUV光刻机超越英特尔的14A工艺；2、该技术采用背面供电设计以提升芯片性能和能效；3、这一竞争凸显了半导体制造领域创新速度的持续加快。

1. TSMC's A16 chip manufacturing technology aims to surpass Intel's 14A by leveraging ASML's advanced High-NA EUV machines; 2. The technology focuses on backside power delivery to enhance chip performance and energy efficiency; 3. The competition underscores the accelerating pace of innovation in semiconductor manufacturing.

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