07/08/2024, 05:07 PM UTC
新材料为芯片能量收集铺平道路New Material Paves the Way to On-Chip Energy Harvesting
1. 研究人员开发了一种由硅、锗和锡制成的新型半导体合金，用于芯片能量收集。2. 这种材料可以将计算机处理器的废热转换回电能，并与CMOS芯片生产工艺兼容。3. 发表在《ACS应用能源材料》上的研究强调了通过减少对外部冷却和电源的需求，实现更可持续和高效的IT设备的潜力。1. Researchers have developed a new semiconductor alloy made of silicon, germanium, and tin for on-chip energy harvesting. 2. This material can convert waste heat from computer processors back into electricity and is compatible with CMOS chip production processes. 3. The research, published in ACS Applied Energy Materials, highlights the potential for more sustainable and efficient IT devices by reducing the need for external cooling and power.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
