05/23/2025, 05:21 AM UTC
台积电新A16技术将采用ASML高数值孔径EUV设备,挑战英特尔14A工艺Kayne Anderson BDC: Q1 Earnings Weaken Appeal (Rating Downgrade)
1、台积电计划于2026年前采用ASML的高数值孔径EUV设备开发A16芯片制造技术;2、A16技术旨在提升芯片性能与能效,与英特尔的14A工艺形成直接竞争;3、此举凸显了半导体制造巨头在先进制程领域日益激烈的技术角逐。1. TSMC plans to adopt ASML's High-NA EUV machines for its A16 chip manufacturing technology by 2026; 2. The A16 technology aims to enhance chip performance and power efficiency, positioning it as a competitor to Intel's 14A process; 3. The move underscores the intensifying rivalry in advanced semiconductor manufacturing between industry leaders.---
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