06/13/2024, 02:20 AM UTC
台积电在台湾快速购买CoWoS先进封装设备TSMC is already buying equipment for two CoWoS advanced packaging plants to be built in Taiwan
1、台积电正在为台湾嘉义的两个CoWoS先进封装工厂购买设备。 2、台积电也在为第三个CoWoS工厂勘测土地。 3、南科嘉义园区的新CoWoS工厂正在进行“环境审查阶段”。 4、台积电的新先进封装工厂将占地约20公顷。 5、首个CoWoS工厂将在2026年建成，创造3000个工作岗位。 6、台积电正在为未来的AI芯片准备其3nm工艺和CoWoS-L封装。 7、英伟达未来的R100 AI GPU将使用台积电的3nm工艺和CoWoS-L封装以及HBM4内存。1. TSMC is buying equipment for two CoWoS advanced packaging plants in Chiayi, Taiwan. 2. TSMC is also surveying land for a third CoWoS plant. 3. The new CoWoS plant in Nanke Chiayi Park is in the 'environmental review stage'. 4. TSMC's new advanced packaging plant will cover around 20 hectares. 5. The first CoWoS plant will be completed by 2026 and create 3000 jobs. 6. TSMC is preparing for future AI chips with its 3nm process and CoWoS-L packaging. 7. NVIDIA's future R100 AI GPU will use TSMC's 3nm process and CoWoS-L packaging with HBM4 memory.---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
