11/13/2024, 11:28 PM UTC
电子元件：低油渗漏和低油迁移的热间隙垫Electronica: Thermal gap pad with low oil-bleed and low oil migration
➀ 智密仕公司研发了一种低油渗漏和低油迁移的热间隙垫；➁ 该垫命名为'Pad 80LO'，具有8W/mK的热导率和60的肖氏硬度；➂ 它旨在对组件施加最小应力，并提供减震功能，适用于GPU、CPU以及电信、国防、储能和车辆等设备。➀ Chomerics has developed a thermal gap pad with low oil bleed and low oil migration; ➁ The pad, named 'Pad 80LO', has a thermal conductivity of 8W/mK and Shore 00 hardness of 60; ➂ It is designed for minimal stress on components and vibration dampening, suitable for GPUs, CPUs, and various equipment in telecomms, defense, energy storage, and vehicles.
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