07/25/2024, 01:06 PM UTC
JEDEC计划为下一代AI应用开发先进内存模块JEDEC plans advanced memory modules for next-gen AI applications
1、JEDEC宣布计划开发包括DDR5多路复用排名双列直插内存模块（MRDIMM）和下一代压缩附加内存模块（CAMM）在内的先进内存模块，以支持高性能计算和AI应用。2、MRDIMM标准旨在将带宽翻倍至12.8 Gbps并提高引脚速度，支持超过两个排名，并确保与传统RDIMM系统的兼容性。3、下一代CAMM模块针对LPDDR6的目标是最高速度超过14.4 GT/s，提供24位子通道、48位通道和连接器阵列。1. JEDEC has announced plans for advanced memory modules including DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMM) and a next-generation Compression-Attached Memory Module (CAMM) for LPDDR6 to support high-performance computing and AI applications. 2. The MRDIMM standard aims to double the bandwidth to 12.8 Gbps and increase the pin speed, supporting more than two ranks and ensuring compatibility with conventional RDIMM systems. 3. The next-generation CAMM module for LPDDR6 targets a maximum speed greater than 14.4 GT/s, offering a 24-bit subchannel, a 48-bit channel, and a connector array.
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