08/05/2024, 11:00 PM UTC
三星将LPDDR5X芯片厚度缩减9%，现仅0.65mm厚Samsung Shrinks LPDDR5X Chips by 9%, Now Just 0.65mm Thick
➀ 三星已开始量产12 GB和16 GB的LPDDR5X模块，采用业界最薄的封装，厚度约为0.65毫米。➁ 通过采用新的封装方法和优化的背磨工艺，实现了超薄设计，热阻提高了21.2%。➂ 更薄的LPDDR5X封装有助于增强智能手机内部的空气流动，显著改善热管理，可能延长设备的使用寿命。➀ Samsung has started mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package, measuring 0.65 mm in thickness. ➁ The ultra-thin design was achieved through new packaging methods and an optimized back-lapping process, offering a 21.2% improvement in heat resistance. ➂ Thinner LPDDR5X packaging enhances airflow within smartphones, significantly improving thermal management and potentially extending device lifespan.---
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