06/18/2025, 04:00 AM UTC
新型3D芯片可使电子设备更快、更节能New 3D chips could make electronics faster and more energy-efficient
➀ 麻省理工学院研究人员开发了一种低成本、可扩展的方法，将高性能氮化镓（GaN）晶体管集成到标准硅CMOS芯片上，提升电子设备的运行速度和能效；
➁ 该方法通过铜柱将微型GaN晶体管键合到硅芯片上，减少材料浪费和系统温度，同时提高智能手机等设备的信号强度和电池续航；
➂ 该混合技术利用GaN在低温下的卓越性能，有望推动功率放大器、无线通信及未来量子计算应用的革新。
➀ MIT researchers developed a low-cost, scalable method to integrate high-performance gallium nitride (GaN) transistors onto standard silicon CMOS chips, enhancing electronics' speed and energy efficiency;
➁ The process involves bonding tiny GaN transistors onto silicon chips using copper pillars, reducing material waste and system temperature while improving signal strength and battery life in devices like smartphones;
➂ This hybrid technology could revolutionize power amplifiers, wireless communication, and future quantum computing applications by leveraging GaN's superior performance at cryogenic temperatures.
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