1. Smiths Interconnect has introduced the TSX Wire Bondable Fixed Chip Attenuator Series to its high frequency surface mount chip attenuator product line. 2. The TSX WB2 Series is qualified to MIL-PRF-55342 and offers broadband performance up to 50 GHz. 3. The series features increased power handling, a small form factor, and is suitable for harsh environments like Space and Defence.