06/26/2025, 05:15 AM UTC
到2030年中国将占据全球晶圆代工产能的30%China to have 30% of foundry capacity by 2030
➀ 中国大陆预计到2030年将占据全球晶圆代工产能的30%(2024年为21%),尽管其本土晶圆需求仅占全球5%,产能扩张势头迅猛;
➁ 地缘政治加剧供需失衡:美国占据57%的晶圆需求但仅拥有10%的产能,台湾和韩国则维持较平衡的供需结构;
➂ 全球晶圆厂利用率将稳定在70%,资本投入回报面临挑战,地缘竞争与产能所有权争夺成为行业核心矛盾,亚洲主导地位进一步巩固。
➀ Mainland China is projected to dominate 30% of global foundry capacity by 2030, up from 21% in 2024, driven by rapid expansion despite low domestic wafer demand;
➁ Geopolitical shifts highlight imbalances: The U.S. accounts for 57% of wafer demand but owns only 10% of capacity, while Taiwan and South Korea maintain balanced supply-demand ratios;
➂ Global foundry utilization will remain around 70%, with ROI concerns as ownership battles and geopolitical tensions redefine industry dynamics, favoring Asian regional dominance.
---
本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。