06/18/2025, 06:40 AM UTC
3D芯片可提升电子设备速度3D Chips Could Make Electronics Faster
➀ 麻省理工学院研究人员开发出低成本铜键合工艺，将氮化镓晶体管集成到标准硅芯片上，提升性能并支持规模化生产；
➁ 该技术避免传统晶圆级键合方式，减少95%的氮化镓材料损耗，400℃以下低温工艺保护芯片敏感组件；
➂ 原型功率放大器展现更优带宽和信号增益，预计将推动消费电子、AI基础设施和量子计算领域的技术革新。
➀ MIT researchers developed a low-cost method to integrate gallium nitride (GaN) transistors onto standard silicon chips using copper bonding, enabling higher performance and efficient scaling;
➁ The process eliminates wafer-level bonding, reduces GaN material waste by 95%, and operates at temperatures below 400°C to prevent thermal damage;
➂ Demonstrated power amplifiers showed superior bandwidth and signal gain, with potential applications in consumer electronics, AI infrastructure, and quantum computing.
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