03/12/2025, 06:09 AM UTC
功率模块封装材料市场2024-2030年复合年增长率达11%，预计2030年将达61亿美元Power module packaging materials market has 11% CAGR 2024-30
➀ 功率模块封装材料市场预计到2030年将达到近61亿美元，2024年至2030年的复合年增长率接近11%；
➁ 2024年，封装材料成本占功率模块总成本的约32%；
➂ 市场正在通过新进入者、并购和战略调整而重塑。
➀ The power module packaging materials market is expected to reach nearly $6.1 billion by 2030, with a CAGR of nearly 11% between 2024 and 2030;
➁ Packaging materials costs accounted for approximately 32% of the total cost of power modules in 2024;
➂ The market is being reshaped with new entrants, M&As, and strategic shifts.
---
本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
