03/12/2025, 02:09 PM UTC
功率模块封装材料市场2024-2030年复合年增长率达11%，预计2030年将达61亿美元Power module packaging materials market has 11% CAGR 2024-30
<p>➀ 功率模块封装材料市场预计到2030年将达到近61亿美元，2024年至2030年的复合年增长率接近11%；</p><p>➁ 2024年，封装材料成本占功率模块总成本的约32%；</p><p>➂ 市场正在通过新进入者、并购和战略调整而重塑。</p><p>➀ The power module packaging materials market is expected to reach nearly $6.1 billion by 2030, with a CAGR of nearly 11% between 2024 and 2030; </p><p>➁ Packaging materials costs accounted for approximately 32% of the total cost of power modules in 2024; </p><p>➂ The market is being reshaped with new entrants, M&As, and strategic shifts.</p>
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