06/23/2025, 06:40 AM UTC
高速、低功耗三维芯片集成技术High Speed, Low Power 3D Chip Integration Tech
➀ 东京科研团队开发出BBCube三维芯片架构，实现DRAM与处理器直接堆叠，芯片间隙仅10微米，单芯片键合时间低于10毫秒；
➁ 采用喷墨打印芯片键合技术、耐高温DPAS300粘结材料，以及嵌入电容器的新型供电系统设计；
➂ 数据传输能耗仅为传统二维系统的5%-20%，为人工智能硬件和边缘计算设备带来革命性性能提升。
➀ Researchers at Science Tokyo developed BBCube - a 3D chip stacking architecture enabling direct DRAM-xPU integration with 10μm chip gaps and 10ms/chip bonding;
➁ Innovations include inkjet-based COW bonding, heat-resistant DPAS300 adhesive, and embedded capacitors for power delivery;
➂ Reduces data transmission energy by 80-95% compared to traditional 2D systems, promising breakthroughs for AI accelerators and edge devices.
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