04/25/2025, 05:28 AM UTC
台积电N3工艺：最后的最佳FinFET节点“The last and best finfet node”
➀ 台积电的N3工艺预计将成为一个长期运行且产量高的节点，由台积电业务发展及海外运营办公室高级副总裁张凯文将其称为“最后的最佳FinFET节点”。
➁ N3工艺包括多个变体，如N3B、N3E、N3P、N3X、N3S、N3RF、N3A和N3C，每个变体都针对不同的应用进行了优化。
➂ 台积电的目标是通过N3工艺开发一个全面且可定制的硅资源，旨在使集成硅性能成为一个平台。
➀ TSMC's N3 process is expected to be a long-running and high volume node, referred to as 'the last and best finfet node' by Kevin Zhang, SVP for Business Development and Overseas Operations Office.
➁ The N3 process includes multiple variants such as N3B, N3E, N3P, N3X, N3S, N3RF, N3A, and N3C, each tailored for different applications.
➂ TSMC's strategy is to develop a comprehensive and customizable silicon resource with the N3 process, aiming to make integrated silicon performance a platform.
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