02/14/2025, 06:47 AM UTC
智能粘接——低应力、低电压粘接Smarter Adhesive Bonding – Bonding with Reduced Stress and Voltage
➀ 该项目的目标是评估使用热固性环氧系统对机械和热敏感组件进行高质量粘接的方法。
➁ 通过开发的具有可调特性的粘合剂池以及局部选择性加热和冷却的各种方法，该项目为具有挑战性的粘接连接提供个别解决方案，特别是在传感器技术和光学领域。
➂ 选择基于使用的基板和对要生产的组件的要求。
➀ The project aimed to evaluate approaches for high-quality bonding of mechanically and thermally sensitive assemblies with thermosetting epoxy systems.
➁ The project offers individual solutions for challenging bonding connections, especially in the fields of sensor technology and optics, through a developed adhesive pool with adjustable properties and various methods of localized selective heating and cooling.
➂ The selection is based on the used substrates and the requirements for the assembly to be produced.
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