09/28/2024, 09:21 PM UTC
华为下一款旗舰级SoC可能缩小与苹果、高通的差距Huawei's Next Flagship SoC Could Close the Gap with Apple and Qualcomm
➀ 华为下一代旗舰级SoC预计将采用5nm麒麟芯片，可能缩小与苹果和高通3nm工艺节点的差距；➁ 据报道，中国政府和SMIC全力支持这款新芯片的开发；➂ 华为之前在5nm麒麟9000 5G AP上的成功表明，该公司能够与行业领先制造商竞争。➀ Huawei's next flagship SoC is expected to use a 5nm Kirin chip, potentially closing the gap with Apple and Qualcomm's 3nm process nodes; ➁ The Chinese government and SMIC are reportedly fully supporting the development of this new chip; ➂ Huawei's past success with the 5nm Kirin 9000 5G AP shows that the company can compete with the industry's leading manufacturers.
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