08/27/2024, 10:41 AM UTC
拆解華為手機:中國半導體僅落後3年?Disassembling Huawei Phone: Is China's Semiconductor Industry Only 3 Years Behind?
➀ 中国的半导体产业在技术和生产能力上估计仅落后台积电3年。➁ 最新的华为智能手机Pura 70 Pro使 用由中芯国际制造的7纳米处理器,其性能与台积电的5纳米处理器相当。➂ 尽管美国实施出口限制,中国通过采购非限制设备并专注于国内生产,稳步提升了其半导体生产技术。➀ China's semiconductor industry is estimated to be only 3 years behind TSMC in terms of technology and production capabilities. ➁ The latest Huawei smartphone, Pura 70 Pro, uses a 7nm processor manufactured by SMIC, which performs similarly to TSMC's 5nm processors. ➂ Despite U.S. export restrictions, China has been steadily improving its semiconductor production technology by procuring non-restricted equipment and focusing on domestic production.
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本文由大语言模型(LLM)生成,旨在为读者提供半导体新闻内容的知识扩展(Beta)。