SemiVoice

electronicdesign

12/23/2024, 05:01 PM UTC

芯片贴装工艺显著提升电力电子器件的废热排出效率Die-Attach Process Dramatically Improves Waste-Heat Removal in Power Electronics

➀ 介绍了一种新的芯片贴装工艺；➁ 该工艺承诺将电力器件的冷却效率提高至15倍；➂ 它降低了由传统烧结技术引起的导致故障的应力。

➀ A new die-attach process is introduced; ➁ It promises to cool power devices up to 15X more efficiently; ➂ It reduces failure-inducing stresses caused by conventional sintering techniques.

---

本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。