11/01/2024, 02:12 PM UTC
Escatec 将紫外光技术集成到晶圆键合机，提高组装精度Escatec adds UV to die bonder to enhance assembly precision
➀ 慧荣科技将紫外光技术集成到其晶圆键合机中，以提高组装精度和效率。➁ 定制的紫外固化系统配备两个365nm光源，能够在无源对准过程中实现精确的元件定位和直接瞬间固化。➂ 此项改进加速了粘合剂的固化过程，提高了整体制造工艺效率，并使元件放置精度得到提升，这对于复杂电子部件的组装至关重要。➀ Escatec has integrated a UV light feature into its die bonder to enhance assembly precision and efficiency. ➁ The custom UV-curing system with two 365nm light sources allows for exact component positioning and direct snap-curing during the passive alignment process. ➂ This enhancement speeds up adhesive curing and improves overall manufacturing process efficiency, leading to increased precision in component placement, crucial for complex electronic parts assembly.
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