➀ Samsung has formed a new HBM development team and is targeting to tape-out HBM4 by the end of the year. ➁ The HBM4 will use Samsung's 4nm foundry process for the logic die and 10nm 6th-generation (1c) DRAM for the memory chip. ➂ Samsung's HBM4 test products are expected to be released next year, with mass production slated for the end of 2025.