08/22/2024, 07:26 PM UTC
先进集成电路封装：芯片战争的新前沿Advanced IC Packaging: The New Battleground in the Chip Wars
➀ 先进集成电路封装正成为半导体产业竞争的关键领域，特别是在美中科技竞争的背景下。➁ 中国在'后端'组 装、封装和测试（APT）领域拥有庞大的市场和先进的技术，使其相对于'前端'晶圆制造而言，对美国制裁的抵抗力更强。➂ 台积电正在扩大其CoWoS封装产能，以解决领先AI处理器的供应限制，而华为则利用其封装技术超越受限制的Nvidia芯片。➃ 由于美国制裁和对依赖美国设计芯片的风险感知，转向中国设计和制造的集成电路的趋势正在加速。➄ 美国和中国都在大力投资先进集成电路封装和芯片技术，以获得竞争优势并减少对外国供应商的依赖。➀ Advanced IC packaging is emerging as a critical area of competition in the semiconductor industry, particularly in the context of US-China technological rivalry. ➁ China has a significant presence and advanced technology in 'back-end' assembly, packaging, and test (APT), making it less susceptible to US sanctions compared to 'front-end' wafer fabrication. ➂ TSMC is expanding its CoWoS packaging capacity to address supply constraints for leading AI processors, while Huawei leverages its own packaging technology to outperform restricted Nvidia chips. ➃ The shift towards Chinese-designed and manufactured ICs is accelerating due to US sanctions and the perceived risk of relying on US-designed chips. ➄ Both the US and China are investing heavily in advanced IC packaging and chiplet technology to gain a competitive edge and reduce dependency on foreign suppliers.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
