08/26/2024, 09:27 PM UTC
亞智大搶面板級封裝RDL商機 700mm設備已出貨給客戶Manz Seizes Panel-Level Packaging RDL Opportunity with 700mm Equipment Delivery
➀ 半導體設備製造商亞智已向多家國際客戶交付300/510/600/700mm面板級封裝RDL生產線。➁ 公司強調面板級封裝因其較高的面積 利用率和較低的生產成本，在AI服務器需求增長的背景下尤為重要。➂ 亞智專注於RDL技術的進步，特別是在高密度玻璃和多樣化化學工藝方面，以滿足先進2.5D和3D封裝日益增長的需求。➀ Manz, a semiconductor equipment manufacturer, has delivered 300/510/600/700mm panel-level packaging RDL production lines to multiple international clients. ➁ The company emphasizes the importance of panel-level packaging due to its higher area utilization and lower production costs, especially in the context of growing AI server demands. ➂ Manz is focusing on advancing RDL technology, particularly in high-density glass and diversified chemical processes, to meet the increasing requirements for advanced 2.5D and 3D packaging.
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