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seekingalpha

06/11/2025, 11:35 AM UTC

台积电3纳米技术突破：开启半导体制造新时代My Top Buy For June's Income Boost: RVT

1、台积电通过改进型FinFET技术实现3纳米工艺突破，性能提升15%且功耗降低30%；2、苹果M3和A17芯片成为首批商用产品，显著增强设备性能；3、规划2025年推出2纳米工艺，采用GAA晶体管架构保持技术领先优势。

1. TSMC achieves 3nm process breakthrough using enhanced FinFET technology, improving performance by 15% and reducing power consumption by 30%; 2. Apple's M3 and A17 chips become first commercial applications, enhancing device capabilities; 3. Future plans include 2nm process development with GAA architecture for 2025 production.

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