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thelec

04/17/2025, 08:50 PM UTC

汉米半导体赢得美光订单，供应50台热压缩键合机Hanmi Semiconductor wins order from Micron to supply 50 TC bonders

➀ 汉米半导体成功获得美光的大订单；

➁ 该订单涉及用于生产高带宽内存（HBM）的热压缩键合机；

➂ 这可能是汉米半导体针对其另一客户SK Hynix提高热压缩键合机价格的原因。

➀ Hanmi Semiconductor has secured a significant order from Micron;

➁ The order is for thermal compression (TC) bonders used in HBM production;

➂ The deal is likely the reason for the increased TC bonder prices for Hanmi's other customer, SK Hynix.

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