09/10/2024, 07:38 AM UTC
美光发布36GB容量的12层HBM3e内存Micron Announces 12-Layer HBM3e Memory at 36GB Capacity
➀ 美光推出了第二代HBM3内存，HBM3e，容量达到36GB，是之前24GB的两倍；➁ 新的内存采用12层设计，比之前的八层更高 ，针对AI市场；➂ 尽管容量增加，美光声称与竞争对手的八层HBM3e产品相比，功耗降低了30%；➃ 新内存预计将被AMD、Nvidia和其他硬件厂商的即将推出的AI加速器使用；➄ 随着AI的兴起，对高带宽内存的需求激增，导致对更高容量和带宽的竞争日益激烈。➀ Micron has launched its second-generation HBM3 memory, HBM3e, with a capacity of 36GB, doubling the previous 24GB limit; ➁ The new memory features a 12-layer design, up from the previous eight layers, and is aimed at the AI market; ➂ Despite the increased capacity, Micron claims to have reduced power consumption by 30% compared to competitors' eight-layer HBM3e products; ➃ The new memory is expected to be used in upcoming AI accelerators from AMD, Nvidia, and other hardware vendors; ➄ The demand for high-bandwidth memory has surged with the AI boom, leading to intense competition for higher capacity and bandwidth.
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