10/22/2024, 01:25 PM UTC
赫洛克半导体获得3.25亿美元芯片法案资金支持Hemlock Semi gets $325m Chips Act funding
➀ 赫洛克半导体获得美国芯片法案3.25亿美元资金支持；➁ 资金将支持在密歇根州赫洛克现有的HSC校园内建设新的制造工厂，用于生产高纯度半导体级多晶硅；➂ 该项目预计将创造近180个制造岗位和超过1000个建筑岗位。➀ Hemlock Semiconductor has been awarded up to $325 million under the US Chips and Science Act; ➁ The funding will support the construction of a new manufacturing facility for hyper-pure semiconductor-grade polysilicon; ➂ The project is expected to create nearly 180 manufacturing jobs and over 1,000 construction jobs.
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