07/30/2024, 04:00 PM UTC
新型材料评估实现功率半导体更可靠的键合More Reliable Bonds for Power Semiconductors with Novel Material Assessment
1. 柏林工业大学和弗劳恩霍夫可靠性与微集成研究所的研究人员开发了一种模拟方法来评估半导体中引线键合的质量。2. 该模拟有助于了解新型、更耐用的引线材料如何影响键合质量。3. 这一创新有助于重新解释新型引线类型的剪切代码，从而提高微电子领域的质量管理。1. Researchers from Technical University of Berlin and Fraunhofer IZM developed a simulation to assess the quality of wire bonds in semiconductors. 2. The simulation helps understand how new, more durable wire materials affect bonding quality. 3. This innovation aids in reinterpreting shear codes for novel wire types, improving quality management in microelectronics.
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本文由大语言模型（LLM）生成，旨在为读者提供半导体新闻内容的知识扩展（Beta）。
