10/04/2024, 11:31 AM UTC
Chiplet时代中的分区挑战Partitioning in the Chiplet Era
➀ 在特定应用领域中采用chiplet正创造着复杂的分区挑战；➁ 大型公司正专注于chiplet以提高性能和降低功耗；➂ 分区涉及映射最佳数据路径、负载均衡和信号 路径的解决方案；➃ 转向chiplet是由扩展收益的限制所驱动的；➄ Chiplet被组装成先进的封装，影响了分区的复杂性；➅ 分区决定了应用的映射、处理和数据移动的优先级；➆ 信号完整性挑战和电源完整性问题是chiplet设计中的问题；➇ Chiplet分区必须考虑信号完整性、电源完整性和热梯度；➈ 多供应商生态系统和标准chiplet插座对于成功的分区至关重要。➀ The adoption of chiplets in domain-specific applications is creating complex partitioning challenges; ➁ Major companies are focusing on chiplets to improve performance and reduce power; ➂ Partitioning involves mapping optimal data paths, load balancing, and signal path workarounds; ➃ The shift towards chiplets is driven by scaling benefits limitations; ➄ Chiplets are assembled into advanced packages, affecting partitioning complexity; ➅ Partitioning determines application mapping, processing, and data movement priorities; ➆ Signal integrity challenges and power integrity issues arise with chiplet design; ➇ Chiplet partitioning must consider signal integrity, power integrity, and thermal gradients; ➈ Multi-vendor ecosystems and standard chiplet sockets are crucial for successful partitioning.
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